摘要
IGBT模块在以短路为代表的非周期过载极端工况中,其自热效应明显。由于高压、大电流等外载荷的冲击,IGBT的温度会在短时内迅速升高,进而影响IGBT芯片的半导体特性以及封装结构的材料特性,并最终直观表现为模块端口电气特性的变化。此时,需要同时关注IGBT的电气特性与温度分布特性,而电问题与热问题在时间尺度上的差异为电热耦合仿真带来了不便。基于此,该文提出一种基于场路耦合的电热联合仿真方法。首先阐述IGBT场路耦合联合仿真的基本原理;然后分别在Simulink与COMSOL中构建基于IGBT物理模型的电路模型以及基于有限元的热模型,通过Matlab控制脚本实现了多速率仿真策略下的电热联合仿真;最后以ABB3.3kV/1500A大功率IGBT模块为例,通过开关暂态测试和短路测试对所提出的仿真方法进行了验证。
The self-heating of IGBT module is obvious in some non-periodic overload extreme conditions,such as short-circuit.Due to the impact of external loads such as high voltage and high current,the temperature of IGBT module will rise rapidly in a short time,which will affect the semiconductor characteristics of IGBT chips and the material characteristics of the packaging structure.The final manifestation is the change of electrical behaviors of IGBT module power terminals.In this case,it is necessary to pay attention to the electrical and temperature distribution characteristics of IGBT module at the same time.However,the difference in time scale between electrical and thermal problems brings inconvenience to the electro-thermal coupling simulation.Therefore,an electrothermal co-simulation method based on field-circuit coupling is proposed in this paper.Firstly,the co-simulation principle is analyzed.Then,a circuit model based on IGBT physical model and a FEM-based thermal model are constructed in Simulink and COMSOL respectively,and the co-simulation under the multi-rate simulation strategy is realized through a control file of Matlab script.Finally,the proposed method is verified by switch transient test and short-circuit test on an ABB 3.3 kV/1500 A high power IGBT module.
作者
贾英杰
肖飞
罗毅飞
刘宾礼
黄永乐
Jia Yingjie;Xiao Fei;Luo Yifei;Liu Binli;Huang Yongle(National key Laboratory of Science and Technology on Vessel Integrated Power System Naval University of Engineering,Wuhan 430033 China)
出处
《电工技术学报》
EI
CSCD
北大核心
2020年第9期1952-1961,共10页
Transactions of China Electrotechnical Society
基金
国家自然科学基金重大项目(51490681)
国家重点基础研究发展计划(973计划)项目(2015CB251004)资助。
