摘要
针对QFP封装互联结构在复杂环境应力下退化特征不明显、缺乏规律分析及验证的问题,开展了QFP结构退化实验。利用基于动态主成分分析和马氏距离的健康指数方法,实现了时域、时频域的特征融合和全寿命周期内的退化表征,发现该方法表征退化起始时刻的精度高达90%以上,并发现了退化速率曲线存在相近拐点并在拐点后出现明显差异的规律。结合扫描电子显微镜微观分析和有限元仿真,验证了不同互联结构在裂纹萌生与扩展处的应变分布存在差异是出现该退化规律的主要原因。
In order to solve the problem that the degradation characteristics of QFP package interconnection structure are not obvious under the stress of complex environment and there is no rule analysis and verification, the degradation experiment of QFP structure was carried out. Using time domain analysis and time frequency domain analysis, the statistical characteristics and inherent energy characteristics of monitoring signals were extracted respectively. Calculating the correlation and robustness parameters of the characteristics, and screening out the characteristics representing the degradation trend. The dynamic principal component analysis algorithm and mahalanobis distance were used to construct the health index. It is found that the accuracy of this method is up to 90% about Initial moment of degradation, and the law that the degradation rate curve has similar inflection point and obvious difference after inflection point. By means of electron microscope image analysis and finite element simulation, it is verified that the difference of strain distribution at crack initiation and propagation is the main reason of this degradation law.
作者
李龙腾
景博
胡家兴
张钰林
李振刚
Li Longteng;Jing Bo;Hu Jiaxing;Zhang Yulin;Li Zhengang(College of Aeronautics Engineering,Air Force Engineering University,Xi’an 710038,China;Air Force Engineering Research Institute,Beijing 100076,China)
出处
《电子测量与仪器学报》
CSCD
北大核心
2019年第12期100-108,共9页
Journal of Electronic Measurement and Instrumentation
基金
陕西省自然科学基金(2015JM6345)
航空科学基金(20142896022)
装备预研共用技术公开项目(41402010102)资助。
