摘要
随着电子产品性能竞争的加剧,电子产品组件对高钎透率、高可靠性的需求与日俱增。综合三种新型高钎透率的真空软钎焊方法,阐述了不同钎焊方式的技术特点。对困扰整个行业的钎料漫溢、钎透率难以有效提升等问题进行了深入研究,在行业内首次针对性地提出了增设排锡槽的工艺方法。选取某型微波T/R组件作为试验对象,最后对组件表面漫锡情况及钎透率进行了观察。试验结果证明,该创新解决措施简单有效,对于下一代电子产品可靠性的研究具有理论和实践上的指导意义。
With the intensifying competition of electronic device performance,the demand for high soldering rate and high reliability of electronic components is increasing day by day.Based on three new methods of vacuum soldering with high soldering rate,and technical features of them are described.Through the intensive study of solder overflow and poor soldering rate,the innovating of the solder discharge groove has been put forward for the first time in the electronic industry.Finally,a type of microwave T/R module is selected as the experimental object,on which the flowing of solder and soldering rate also have been observed.The experimental results show that the fresh idea of solder discharge groove is simple and effective,which has great guiding significance in practice and theory for the research on the reliability of the next generation of electronic products.
作者
王禾
潘旷
杨程
温丽
薛松柏
WANG He;PAN Kuang;YANG Cheng;WEN Li;XUE Songbai(The 38th Research Institute of CETC,Hefei 230031,China;College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)
出处
《电子工艺技术》
2019年第6期332-335,340,共5页
Electronics Process Technology
基金
国家自然科学基金项目(51675269)
装备预先研究项目(41423070103)
关键词
电子产品
真空钎焊
钎透率
可靠性
electronic product
vacuum soldering
soldering rate
reliability
