摘要
为了应对集成电路中日益严峻的热问题,本文实验研究了矩形单层微通道(S-R)、锯齿单层微通道(S-Z)、矩形双层微通道(D-R)以及下层矩形上层锯齿微通道(D-R-Z)四种结构内流体的流动及换热特性,实验结果表明:相同流量下这四种结构的压降逐渐增加,双层结构的换热特性好于单层结构.在D-R结构中,将上层吸热量较多的矩形通道换为锯齿形通道后,整体性能得到提升.
To deal with the increasingly severe thermal issues in integrated circuits, the flow and heat transfer characteristics of the fluid in S-R, S-Z, D-R and D-R-Z are experimentally investigated.The results indicate that: the pressure drop of these four structures increases gradually under the same flow rate, the heat transfer characteristics of double-layer channels is better than single-layer channel. In the D-R structure, when the rectangular channel with more heat absorption replaced by zigzag channel, the overall performance is improved.
作者
王卓
夏国栋
马丹丹
杨宇辰
WANG Zliuo;XIA Guo-Dong;MA Dan-Dan;YANG Yu-Chen(Key Laboratory of Enhanced Heat Transfer and Energy Conservation Ministry of Education, College of Environment al and Energy Engineering, Beijing University of Technology, Beijing 100124, China)
出处
《工程热物理学报》
EI
CAS
CSCD
北大核心
2019年第5期1126-1130,共5页
Journal of Engineering Thermophysics
基金
国家自然科学基金资助项目(No.51576005)
关键词
3D-IC
微通道
传热特性
3D-IC
microchannel
heat transfer characteristics
