摘要
随着无铅钎料性能的提升和人们环保意识的提高,无铅钎料也逐渐被应用在特殊环境中。介绍特殊环境用无铅钎料可靠性的研究进展及趋势,分析特殊环境中无铅钎料焊点失效的原因,探讨各种特殊环境中提高无铅钎料可靠性的方法和机理,如微合金化、颗粒强化和基板改善,总结目前无铅钎料可靠性研究存在的不足,对无铅钎料未来的研究方向提出建议。
Lead-free solders are applied under special conditions with the improvement of property of the solders and people's awareness of environmental protection.The research status and development trend of lead-free solders used under special conditions were reviewed synthetically.First of all,the failure mechanism of solder joints under different special conditions was discussed.Moreover,the ways to enhance the reliability of lead-free solders under several special conditions were reported and analyzed,such as microalloying,particle strength and substrate improvement.In addition,the defects of the current reliability research of lead-free solders were summarized,and the further research was prospected.
作者
王剑豪
薛松柏
马超力
龙伟民
钟素娟
WANG Jian-hao;XUE Song-bai;MA Chao-li;LONG Wei-min;ZHONG Su-juan(College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 211106,China;State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering,Zhengzhou450002,China)
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2018年第12期2499-2511,共13页
The Chinese Journal of Nonferrous Metals
基金
国家自然科学基金资助项目(51675269)
江苏高校优势学科建设工程资助项目~~
关键词
特殊环境
无铅钎料
微合金化
颗粒强化
基板改善
可靠性
special condition
lead-free solder
microalloying
particle strength
substrate improvement
reliability