摘要
通过激光诱导化学镀技术实现了ABS塑料表面电磁屏蔽功能电子线路的制备。将10 g/L NiSO_4·6H_2O+40 g/L NaH_2PO_2·H_2O混合溶液涂覆于铜线路表面,利用激光雕刻机以0.1 mm的光斑直径和5 mm/s的扫描速率对预先用类似方法在ABS塑料上制备的铜线路镀层进行扫描活化,然后化学镀Ni–P–Cu合金。采用扫描电镜、能谱仪、法兰同轴测试系统、四探针测试仪和热循环试验对线路的表面形貌、组成、电磁屏蔽性能、电阻率和结合力进行表征。结果表明,活化后的线路表面附着一层20 nm左右的Ni微粒,所得Ni–P–Cu合金镀层的电磁屏蔽效能接近80 dB,屏蔽功能线路的电阻率为3.72×10^(-8)?·m,结合力良好。
The electronic circuits with electromagnetic shielding property were prepared on the surface of ABS plastic by laser-induced electroless plating technology as follows:(a)coat the copper circuits(pre-prepared with the similar method)with a mixed solution comprising NiSO4·6H2O 10 g/L and NaH2PO2·H2O 40 g/L;(b)activate the coating on copper circuit with laser generated by a laser engraving machine with a spot diameter of 0.1 mm at a scanning rate of 5 mm/s;and(c)electroless plate with Ni-P-Cu alloy.The surface morphology,elemental composition,electromagnetic shielding property,and resistivity of circuit were characterized using scanning electron microscope,energy-dispersive spectrometer,flange coaxial test system,and four-point probe tester,respectively.The adhesion of circuit to substrate was evaluated by thermal cycle testing.The results showed that a layer of Ni particles with a diameter of 20 nm adheres to the surface of the laseractivated copper circuit.The Ni-P-Cu alloy coating obtained features an electromagnetic shielding effectiveness close to 80 dB.The well-adhered electromagnetic shielding circuit has a resistivity of 3.72×10^-8Ω·m.
作者
崔开放
钟良
代竟雄
CUI Kai-fang;ZHONG Liang;DAI Jing-xiong(College of Science and Engineering,Southwest University of Science and Technology,Mianyang 621000,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第17期777-780,共4页
Electroplating & Finishing
基金
西南科技大学博士基金(14zx7162)
西南科技大学研究生创新基金(18ycx107)
关键词
丙烯腈-丁二烯-苯乙烯共聚物
化学镀
铜
镍-磷-铜合金
激光诱导
电磁屏蔽
电子线路
acrylonitrile–butadiene–styrene copolymer
electroless plating
copper
nickel–phosphorus–copper alloy
laser activation
electromagnetic shielding
electronic circuit
