摘要
以铺展性能为主要评价指标,探讨无卤素低银无铅焊膏中活性剂的选择。对常用于助焊剂的10种有机酸活性物质进行筛选,从中选取一种性能优异的己二酸与已知两种羧酸配成复合活性物质,并通过正交实验对三种有机酸的复配比例进行优化。通过正交试验,调整溶剂、松香、活性剂和表面活性剂的含量。结果表明:溶剂、松香、表面活性剂和活性物质质量分数分别为36%,35%,5%和6%,羧酸X、羧酸Y与己二酸的比例为1:2:4时,焊膏有良好的润湿性和抗塌陷性,锡珠试验达到标准一级水平。
This paper chose the spreadability as the main evaluation index to determine the activators of halogen-free low-silver lead-free solder paste.By selecting from10kinds of organic acid used for flux,adipic acid was manufactured into composite activators with the combination of carboxylic acid X and carboxylic acid Y,and the proportion of three organic acids was optimized.Orthogonal experiments were undertaken in order to adjust the contents of solvent,rosin,surface activator and activator.The results show that the solder paste has good wettability and anti-slump ability without any solder ball when the flux are made from36%solvent,35%rosin,5%surface activator and6%activator(mass fraction)and the mass ratio of carboxylic acid X to carboxylic acid Y to adipic acid is1:2:4.
作者
郝娟娟
顾建
赵鹏
雷永平
林健
HAO Juanjuan;GU Jian;ZHAO Peng;LEI Yongping;LIN Jian(The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China)
出处
《电子元件与材料》
CAS
CSCD
2017年第3期63-67,共5页
Electronic Components And Materials
基金
国家自然科学基金资助(No.51275006)
北京市自然科学基金重点项目资助(No.KZ20110005002)
关键词
无铅焊膏
助焊剂
活性物质
铺展
无卤素
有机酸
lead-free solder paste
flux
activator
spreading
halogen-free
organic acid
