期刊文献+

对数螺线指尖密封的装配变形分析 被引量:7

Assembly Deformation Analysis of Logarithmic Screw Curve Finger Seal
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摘要 采用有限元法对两片叠置的对数螺线指尖密封在装配状态下由于指尖数目的不同对装配变形所产生的影响进行了数值分析 ,重点研究了由于装配变形可能造成的密封片接触表面间出现间隙的问题 ,以及由于指尖周向变形错位可能导致的指尖缝隙密封失效问题。 A fundamental research with finite element method(FEM) has been conducted for the logarithmic screw curve finger sealing mechanism. Research was carried out on the influence of different number of fingers on the assembly deformation of sealing mechanism which is assembled with two laminate finger elements. The clearance between the stacked sealing sheet and circumferential staggering of the finger curved beam caused by the assembly deformation of sealing mechanism was deeply investigated. The research work here is significant for optimizing finger seal configuration to prevent sealing mechanism from by pass leakage.
出处 《机械科学与技术》 CSCD 北大核心 2002年第6期866-867,共2页 Mechanical Science and Technology for Aerospace Engineering
基金 航空科学基金 (0 1C5 3 0 17) 教育部现代设计及转子轴承系统重点实验室访问学者基金 (2 0 0 0 -12 3 ) 留学回国人员科研启动基金资助
关键词 对数螺线 指尖密封 装配变形 有限元 Finger seal Assembly deformation FEM
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参考文献3

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  • 2Arora Gul K, et al. Pressure balanced, low hysteresis, finger seal test results[R].AIAA-99-2686,1999
  • 3陈国定等. 指尖型线力学性能的有限元分析[A]. 中国航空学会动力分会第十届机械动力传输专业学术研讨会论文集[C], 2001,10,山西大同

同被引文献18

  • 1白花蕾,吉洪湖,纪国剑,曹广州.指式密封泄漏特性的实验研究[J].航空动力学报,2009,24(3):532-536. 被引量:15
  • 2[1]Gul K. Arora, et al. Pressure Balanced, Low Hysteresis,Finger Seal Test Results[ R]. NASA/TM-1999-209191
  • 3[2]Steinefz B M, Hendricks R C. Advanced Seal Technology in Meeting Next Generation Turbine Engine Goal[ R]. NASA/TM-1998-206961
  • 4[1]Braun M J,et al.Non-contracting finer seal developments and design considerations.NASA/CP-2004-212963,vol1,2004
  • 5[2]Honeywell International Inc.Dual pressure balanced non-contacting finger seal.USA patent number:US6364316,2,April,2002
  • 6[3]Braun M J,Kudriavtesv V V.Two and three dimensional numerical experiments representing two limiting eases of an inline pair of finger sea components.The 9th International Symposium on Transport Phenomena and Dynamics of Rotating Machinery,Honolulu Hawaii,February 10-14,2002
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