摘要
对化学镀镍的反应机理进行分析 ,提出次磷酸钠还原效率的概念 ,推导出次磷酸钠还原效率的计算公式。通过实验测定低温化学镀镍工艺中次磷酸钠的还原效率 ,并讨论了次磷酸钠。
The reaction mechanism of electroless nickel plating is analyzed; a concept of the reduction efficiency of sodium hypophosphite proposed; and the calculation formula for the efficiency derived. The reduction efficiency of sodium hypophosphite in low temperature electroless nickel plating process is determined through experiments; and the effects of sodium hypophosphite, complexing agents and accelerant on the reduction efficiency of sodium hypophosphite discussed.
出处
《电镀与环保》
CAS
CSCD
2002年第5期17-19,共3页
Electroplating & Pollution Control
关键词
低温
化学镀镍
次磷酸钠
还原效率
电镀
镀液
Electroless nickel plating
Low temperature
Sodium hypophosphite
Reduction efficiency
