摘要
在电流密度为1136A/cm^2的情况下,考察了直流电场对Al—Cu共晶片间距的影响。实验结果表明,电场使片间距减小。分析表明,这是由以下三个方面的原因引起的:(1)电场使共晶两相中的其中一相在另一相上形核并长大;(2)电场使相转变所需的驱动力减少;(3)电场使层片缺陷可以向片间距减小的方向运动。
Abstract
In this paper, the effect of direct current electric field with current density of 1136A/cm2 on the Al-Cu eutectic interlamellar spacing was examined. The experimental results showed that electric field causes the interlamellar spacing to decrease. On the basis of experimental, reasons for to this are: ( 1 ) electric field causes one phase of eutectic to nucleate and grow on another phase, ( 2 ) electric field decreases the driving force which is essental to phase transition, ( 3 ) electric field allows the interlamellar faults to move in the direction of decreasing the interlamellar spacing.
出处
《铸造》
CAS
CSCD
北大核心
1991年第3期5-9,共5页
Foundry
基金
本课题为1987年国家自然科学基金5870007资助项目
