摘要
During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cool- ing techniques for electronic and microelectronic devices.This paper provides a review and summary of the programs with emphasis on direct liquid cooling.Included in this review are the heat transfer investigations related to the following cooling modes:liquid free,mixed and forced convection,liquid jet impingement,flowing liquid film cooling,pool boiling,spray cooling,foreign gas jet impingement in liquid pool,and forced convection air-cooling.
