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Forced Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel

Forced Convective Air Cooling from Electronic Component Arrays in a Parallel
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摘要 This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas waspresented to correlate the experimental data for the design of air cooling systems. Arrays of components with one odd-size module have been tested also. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared with uniform arrangements. Accordingly, temperature sensitive components are suggested to be arranged in these locations.
出处 《Journal of Thermal Science》 SCIE EI CAS CSCD 1994年第3期161-166,共6页 热科学学报(英文版)
关键词 convection heat transfer air cooling 强制对流 热传导 电子器件阵列 空气冷却
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