摘要
近年来,电子技术的迅猛发展,使集成电路产业发展规模不断扩大,并已成为推动我国经济发展的重要产业。在集成电路产业中,电路的设计、制造以及封装是其三大组成部分,对于微电子封装来说,其封装质量直接关系到整个集成电路的可靠性,因此,必须确保微电子的封装质量良好。上世纪末以来,科学家对微电子封装中的代表性技术进行深入研究,以期能够提高我国集成电路封装质量。
In recent years, with the rapid development of electronic technology, the scale of integrated circuit industry had been expanding, and had become an important industry to promote China＇s economic development. In the integrated circuit industry, circuit design, manufacturing and packaging were the three major components. For microelectronic packaging, the packaging quality is directly related to the reliability of the entire integrated circuit. Therefore, we ensured that the packaging quality of microelectronics was good. Since the end of last century, scientists had studied the representative technology of microelectronic packaging in order to improve the quality of integrated circuit packaging in China.
作者
彭强
PENG Qiang(Shanwei Vocational Technical College,Shanwei 516600,China)
出处
《江西电力职业技术学院学报》
CAS
2018年第7期11-12,共2页
Journal of Jiangxi Vocational and Technical College of Electricity
