摘要
低温共烧陶瓷基板应用在微波和毫米波电路模块中具有独特的技术优势。针对LTCC基板打孔机进行了智能化设计,并在自主研制的自动化设备的基础上,通过对打孔机结构、通讯接口、视觉定位以及检测系统等方面进行改进,提高了打孔机的智能化程度,达到与车间物流系统和数字化平台系统等互联互通的能力,具备自诊断和自分析等能力。
LTCC（Low Temperature Co-Fired Ceramics） substrate has unique technical advantages in microwave and millimeter wave circuit module. The intelligent design of the punching machine for LTCC green tape is carried out. The intelligent degree of the punching machine is improved by improving the structure of the punching machine, communication interface, visual positioning and detection system based on the basis of automatic equipment developed by ourselves. The punching machine can be connected with the workshop logistics system and the digital platform system, and has the ability of self-diagnosis and selfanalysis.
作者
赵付超
王花
吕麒鹏
刘鹏
ZHAO Fuchao;WANG Hua;LV Qipeng;LIU Peng(The Second Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工艺技术》
2018年第4期238-240,共3页
Electronics Process Technology
关键词
低温共烧陶瓷
生瓷片
智能打孔
数字化
智能化
low temperature co-fired ceramics
green tape
intelligent drilling
digitalization
intellectualization
