摘要
The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.
对用于替换Sn-Pb共晶焊料的Sn-Ag-Cu(SAC)焊料来说,Sn-Cu-Ni-Ge焊料是一个巨大的挑战。本文作者研究添加Ag、Bi、In和Sb对Sn-0.6Cu-0.05Ni-Ge(SCNG)无铅焊料物理性能的影响及与铜基体的界面反应。研究SCNG-x焊料的熔化行为、显微组织、抗拉强度和润湿性。结果表明,Ag、Bi、In和Sb的引入对焊料的固相温度、液相温度和抗拉强度有微小的影响。但是,合金元素的浓度会影响焊料的冷却性能和凝固组织。除锑以外的合金元素的添加,提高了SCNG焊料的润湿性。合金元素的加入增加了金属间化合物层的厚度,这与焊料的冷却行为有关。SCNG-x焊料与铜基体之间的金属间化合物层形貌与典型的SAC焊料不同。总之,用Ag、Bi、In或Sb对SCNG焊料进行合金化,可以改善焊料的特性。
基金
King Mongkut’s Institute of Technology Ladkrabang and the National Research Council of Thailand for the financial sponsorship of this project
