摘要
该文介绍了一种Ku波段瓦片式发射/接收(T/R)组件的工艺设计技术。组件整体采用了低温共烧陶瓷(LTCC)高频基板、低频电源印制电路板(PCB)和控制PCB板,利用立体组装的方式实现产品的小型化。产品采用金锡焊接SMP接头实现气密性焊接,同时采用4种焊接材料实现了产品的温度梯度焊接,并对关键工艺进行了工艺鉴定分析,保证了产品的长期可靠性。
The process design technique of a Ku-band tile-type T/R module is described in this paper. The whole module adopts the LTCC high-frequency board, low-frequency power PCB board and control PCB board, and uses the three-dimensional assembly method to achieve product miniaturization. The product adopts gold-tin soldered SMP joints to achieve hermetic welding. At the same time, four kinds of welding materials are used to achieve the temperature gradient welding of the products. And the process identification of key processes is carried out to ensure the long-term reliability of the product.
作者
廖雯
毛繁
但雪梅
何玮洁
刘明强
LIAO Wen;MAO Fan;DAN Xuemei;HE Weijie;LIU Mingqiang(The 26th Institute of China Electronics Technology Group Corporation,Chongqing 400060,Chin)
出处
《压电与声光》
CAS
CSCD
北大核心
2018年第3期323-325,330,共4页
Piezoelectrics & Acoustooptics
基金
国家重点项目
