摘要
目的通过化学镀铜技术,在聚酰亚胺基板表面沉积电导率高且致密均匀的薄铜层。方法采用以硫酸铜为铜源的甲醛溶液体系,在预处理后的聚酰亚胺薄膜表面沉积铜层。通过原子力显微镜和接触角测试仪对预处理前后的聚酰亚胺基板表面粗糙度进行分析,通过扫描电子显微镜对铜层表面微观形貌进行观察,通过四探针测试仪和法兰同轴测试仪分别测试所制备铜层的方阻及屏蔽效能。结果聚酰亚胺基板与水的接触角由预处理前的38°减小至预处理后的27°,化学镀铜层微观形貌致密、均匀。方阻随镀层厚度增加而减小,具有优异的导电性。屏蔽效能测试表明,在100 k Hz^12 GHz时,镀铜聚酰亚胺基板最高屏蔽效能达到55 d B。结论通过简单基板预处理与控制镀铜时间,可以在聚酰亚胺基板上沉积综合性能优良的薄铜层,且屏蔽效能可达商用标准。
The work aims to deposit a dense and uniform thin copper layer of high conductivity on the surface of polyimide baseplate. Formaldehyde solution system taking copper sulfate as copper source was used to deposit copper layer on the surface of pretreated polyimide（PI） film. Surface roughness of the PI baseplate before and after pretreatment was analyzed with atomic force microscope（AFM） and contact angle meter（CAM）. Surface morphology of the copper layer was observed with scanning electron microscope（SEM）. Sheet resistance and shielding effectiveness of the as-prepared copper layer was tested with four probes tester and flange coaxial tester, respectively. The contact angle between PI baseplate and water reduced from 38° before pretreatment to 27° after pretreatment. The microstructure of electroless copper layer was compact and uniform. The sheet resistance decreased as the plating thickness increased, and the copper layer exhibited excellent electroconductibility. The maximum shielding effectiveness of copper plated PI baseplate could reach up to 55 d B in the scope of 100 k Hz^12 GHz. Simple baseplate pretreatment and controlled copper plating time can contribute to deposition of quality copper layer on PI baseplate, and the shielding effectiveness meets the commercial standard.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2017年第12期186-191,共6页
Surface Technology
关键词
聚酰亚胺
化学镀铜
屏蔽效能
polyimide
electroless copper plating
shielding effectiveness
