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像素法用于保温材料黏结面积比检测的可靠性研究

Study on Reliability of Pixel Method Used in Measuring Bond Area Ratio of Thermal Insulation Material
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摘要 为提高保温材料黏结面积比检测的精度,解决钢尺测量黏结面积受制于黏结砂浆形状不规则的问题,提出由像素值代替实际面积值进行比值计算的像素法,设计彩色碎纸面积比检测试验及点框黏式保温板黏结面积比检测试验研究像素法的可靠性。研究结果表明,像素法检测彩色碎纸面积比的结果与预设值完全相等,像素法检测保温板黏结面积比的结果与方格纸法一致,但检测效率是方格纸法的百倍,钢直尺法与前两种方法相比,检测结果的相对误差高达12.2%,像素法是一种值得推广应用的既精准又高效的保温材料黏结面积比检测方法。 In order to improve the thermal insulation material of bond area ratio the detection precision, resolved measurement of bond area subject to mortar problems of irregular shape, as proposed by the numerical value instead of the actual area ratios were calculated as number method, design of confetti area ratio test and frame adhesion type insulation board bonded area ratio the reliability test of pixels method. The results showed that the pixels method detection confetti area ratio results with the preset value completely equal, pixels method detected results of insulation plate bonding area ratio and graph paper, but the detection efficiency was 100 times the graph paper, compared with the previous two methods of steel ruler method, the relative error of detection results up to 12.2%,pixel method was a detection method worthy of popularization and application of both accurate and efficient thermal insulation material bonded area ratio.
出处 《工程质量》 2017年第12期71-74,共4页 Construction Quality
关键词 保温材料 黏结面积比 剥离检验 像素 thermal insulation material bonding area ratio stripping test pixel
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