摘要
深空探测的环境多为极低温大温变环境,研究电子器件在此极限条件下的可靠性具有重要意义.采用多线性等向强化(MISO)本构模型描述Sn63Pb37和Sn96.5Ag3.0Cu0.5(SAC305)焊料的力学本构行为,分析陶瓷球栅阵列(ceramic ball grid array,CBGA)焊点阵列在极限温度(-180^+150℃)热冲击载荷下的应力应变分布情况,最后根据基于能量的Darveaux疲劳模型预测CBGA焊点的热冲击疲劳寿命.结果表明,局部热失配导致应力最大点出现在边角焊点陶瓷载体一侧的焊盘与钎料界面,极限温度热冲击载荷下焊点的疲劳寿命远低于标准温度循环载荷下的疲劳寿命.
Deep space exploration requires operations under extreme cold temperature and wide temperature range condition. Thus,it is significant to inestigate the reliability of electronic device under such condition. In this study,multilinear isotropic hardening( MISO) model was used to describe the mechanical behavior of Sn63Pb37 and Sn96.5Ag3.0Cu0.5 solders,the stress and strain distribution of soldered joints under extreme temperature thermal shock were obtained. In the end,the thermal fatigue life of CBGA was predicted by Darveaux energy model. The results showed that the maximum stress caused by a local stress condition was located in the interface of pad on the package side and solder. Fatigue life of soldered joints under extreme temperature thermal shock was much lower than that of soldered joints under thermal cycling with standard temperature range.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2017年第10期93-97,共5页
Transactions of The China Welding Institution
基金
上海航天科技创新基金资助项目(SAST201465)
关键词
陶瓷球栅阵列
极限温度
热冲击
疲劳寿命
有限元
CBGA
extreme temperature
thermal shock
fatigue life
finite element method
