摘要
基于SiP技术的射频收发系统能显著减小传统射频系统的体积,提高系统的稳定性。基于系统级封装的无线射频收发系统可以将具有不同功能的子系统集成起来,在一个封装体内形成较完整的系统,是一种高密度集成封装形式。基于系统级封装的无线射频收发系统具有两个核心特征,一是可以将模拟、微波和数字等不同工艺的芯片集成在一个封装中,各种不同功能的芯片可以采用各自不同的最佳工艺技术来设计制造,从而实现强大的、多种类的系统功能;二是可以将过去系统母板上的分立元件集成在多层封装基底中,使系统小型化。面向系统级封装的无线射频收发系统是未来发展的必然趋势。
RF transceiver system based on Si P technology can significantly reduce the size of the traditional RF system and improve the stability of the system. The RF transceiver system based on system level packaging can integrate the subsystems with different functions and form a complete system in a package. The wireless RF transceiver system based on the package has two core features. Firstly,it has the capacity to integrate many chips in a single chip,these chips may be analog,microwave and digital chips,and they can be designed and manufactured using their own appropriate technics,so the Si P can realize the multifunctional system. Secondly,the Si P can make the system minimize,because it can integrate components in the multilayer substractes,which are placed on the motherboard past. System oriented wireless RF transceiver system is the inevitable trend of future development.
出处
《微型机与应用》
2017年第20期67-70,共4页
Microcomputer & Its Applications
