摘要
基于目前电连接器向轻量化和微型化的方向发展,提出了采用三维打印的方法制备密度小、具有规则排列孔位的微型电连接器绝缘基座。采用α-Si_3N_4、BN、SiO_2、玉米淀粉等制成浆料,通过三维打印的方法,得到孔位尺寸排列为0.635 mm的绝缘基座胚体,经微波烧结成型制得绝缘基座。结果表明:当α-Si_3N_4、BN、SiO_2、(C_6H_10O_5)n按第1~3组配比制得浆料时,浆料黏度随剪切速度的变化规律一致,且具有较好的打印成型性能;微波烧结后基座尺寸收缩率为8%~18%,孔位误差为±0.05 mm,复合材料基座相邻孔位的耐电压范围为1 000~1 400 V,绝缘电阻为6.5×1010~5.5×1012Ω,淀粉挥发形成的空隙直径为2~10μm,密度为1.25~1.44 g/cm3。
Based on the light weight and miniaturation development of electrical connectors, a three-dimen- sional printing method was proposed to prepare miniature electrical connectors insulating base with small density and regularly arranged holes, a-Si3N4, BN, SiO：, corn starch and other materials were used to prepare slurry, and an insulating base embryo with 0.635 mm×0.635 mm of arranged holes was prepared by three-dimensional printing method. Then the insulating base was obtained through microwave sintering molding. The results show that when the mass proportion of a-Si3N4, BN, SiO2 and （C6H10O5）. is in accordance with group 1- 3, the viscosity of the slurry changes in the same law with shear velocity, and the slurry has better printing performance. After microwave sintering, the shrinkage rate of the base is 8%- 18%, the hole position error is ±0.05 mm, the withstand voltage and insulation resistance range of adjacent holes of the composite insulation base is 1 000～ 1 400V and 6.5×10^10～5.5×10^12 Ω, respectively; the diameter of voids formed by starch evaporation is 2 ～ 10 μm, and the density is 1.25- 1.44 g/cm^3.
作者
梁云忠
伍权
汤耿
李红
徐卫平
Liang Yunzhong Wu Quan Tang Geng Li Hong Xu Weiping(School of Mechanical and Electrical Engineering, Guizhou Normal University, Guiyang 550001, China)
出处
《绝缘材料》
CAS
北大核心
2017年第9期36-39,共4页
Insulating Materials
基金
贵州省自然科学基金资助项目(黔科合LH字[2014]7043号)
关键词
绝缘基座
3D打印
氮化硅
轻量化
电连接器
insulating base
3D printing
silicon nitride
light weight
electrical connector
