摘要
以AlN为导热填料制备了高导热环氧树脂绝缘材料。根据AlN填充量、AlN表面改性方法、树脂固化温度、不同粒径AlN填充比例4个因素,设计不同水平正交试验,通过极差分析法和方差分析法,确定了AlN填充量为影响热导率的最关键因素;此外,不同粒径AlN的填充比例和树脂固化温度也是影响AlN/EP热导率的关键因素。最后,考察了以上3个关键因素对AlN/EP体积电阻率、表面电阻率和沿面闪络击穿电压的影响规律。结果表明:在低温固化、AlN填充量为60%、微米/纳米AlN按50%比例混合填充时,AlN/EP的热导率最高可达1.13 W/(m·K);AlN/EP的体积电阻率、表面电阻率和沿面闪络击穿电压均随AlN填充量和纳米AlN比例的增加而提高,在80℃以下随着固化温度的升高而逐渐降低。
A high thermal conductive epoxy resin（EP） insulating material was prepared using AIN as thermal conductive filler. Different orthogonal experiments were designed using AlN content, AlN surface modification method, resin curing temperature, and filling ratio of AlN with different particle sizes as four factors. It was determined that the most significant factor of thermal conductivity is AlN content by range analysis and variance analysis. In addition, the filling ratio of AlN with different particle sizes and resin curing temperature are also the key factors of thermal conductivity. The effects of these three fac- tors on the volume resistivity, surface resistivity, and surface flashover breakdown voltage of the AlN/EP composites were investigated. The results show that when the curing temperature is low, the AIN content is 60%, and the filling ratio of micro- and nano-AlN is 50%, the thermal conductivity of AlN/EP reaches the highest 1.13 W/（m·K）. The volume resistivity, surface resistivity, and surface flashover breakdown voltage of AlN/EP increase with the increase of nano-AlN content, and decrease with the increase of curing temperature below 80 ℃.
作者
杨黎
张腾
滕玉平
张东
黄晓斌
闫存极
徐菊
海彬
Yang Li Zhang Teng Teng Yuping Zhang Dong Huang Xiaobin Yan Cunji Xu Ju Hai Bin(Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China University of Chinese Academy of Sciences, Beijing 100190, China)
出处
《绝缘材料》
CAS
北大核心
2017年第9期1-6,共6页
Insulating Materials
基金
国家自然科学基金资助项目(51477168
51377154)
关键词
ALN
环氧树脂
热导率
绝缘材料
AlN
epoxy resin
thermal conductivity
insulating material
