摘要
通过差热分析、扫描电镜显微组织分析、真空钎焊等手段,对不同Pd含量Ag-Cu-Pd钎料的熔化特性以及在无氧铜和镍上铺展性进行研究,并对铸态组织和钎焊界面组织进行分析.结果表明,随着Pd含量增加,Ag-Cu-Pd钎料的固相线温度、液相线温度有明显提高,固液相线温度间隔也随之增大;当Pd含量为10%和20%时钎料铺展性良好,且随着Pd含量增加,钎料合金铺展性降低,但当Pd增加到30%时,钎料铺展性变差且有轻微侵蚀迹象;铸态Ag-Cu-Pd合金中Pd元素主要存在于富铜相中;Ag-28Cu-20Pd钎料焊接无氧铜板时的钎焊界面,形成连续的金属间化合物(IMC)层,钎料中Pd元素主要分布在IMC层上.
The effects of Pd content on the melting properties, spreading properties on oxygen-free copper and nickel, as-cast organization of Ag-Cu-Pd solder, and brazing interface were studied. The results show that the solidus temperature and the liquidus temperature of Ag-Cu-Pd solder are obviously improved with the increase of Pd content. Accordingly, the temperature interval of solid-liquid phase line also increases. When Pd is 10 % and 20 %, the solder spreadability is optimal. In addition, the spreadability of solder alloy is reduced with the rising Pd content. When Pd is increased to 30 %, solder spreadability begins to deteriorate and there are signs of slight erosion. The Pd in Ag-Cu-Pd alloy is mainly present in the Cu-rich phase. The brazing interface forms a continuous intermetallic compound （IMC） layer when Ag-28Cu-20Pd solder is welded to the oxygen- free copper plate, with most of Pd distributing in IMC layer.
出处
《有色金属科学与工程》
CAS
2017年第3期64-68,共5页
Nonferrous Metals Science and Engineering
基金
北京市人才培养资助项目(2013年)
