摘要
挠性印制板和刚挠结合印制板的市场需求越来越大,其对板材的要求比如表面粗糙度、表面材料改性提出了高要求,使用等离子清洗和PI表面改性剂可以达到粗化和表面改性的目的,文章着重介绍两者在FPCB组装中的应用。
The flex PCBs and rigid-flex PCBs are increasing, which needs the base film to have more special characteristics, such as surface roughness, surface modification of materials. Both plasma and PI surface modification agent can make it. This paper mainly discusses on the two applications on FPCB assembly part.
作者
胡珂珂
王俊
曾平
谭小林
HU Ke-ke WANG Jun ZENG Ping TAN Xiao-lin
出处
《印制电路信息》
2017年第2期7-10,共4页
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