摘要
采用扫描电化学显微镜(SECM)分析技术、电化学阻抗谱(EIS)和电容-电位测试研究了镀锌层表面钝化膜在质量分数5%NaCl溶液中的腐蚀降解过程和半导体行为。结果表明:浸泡过程中随着水和离子逐渐侵入钝化膜,钝化膜发生着缓慢的腐蚀降解,钝化膜在浸泡初期保持稳定,能够对基体金属起到较好的保护作用;钝化膜表现出n型半导体特征,随着浸泡时间的延长,Mott-Schottky曲线拟合直线的斜率逐渐减小,钝化膜载流子密度逐渐增大,表明钝化膜在浸泡过程中发生缓慢的腐蚀降解。
The corrosion degradation process and semiconducting character of passivation film on the surface of zinc coating were examined in 5% （mass） NaCl solution by means of scanning electrochemical microscopy （SECM）, electrochemical impedance spectroscopy （EIS） and potential-capacitance measurement. The results show that as water and ions gradually invaded into the coating, the passivation film was under slow corrosion degradation. The passivation film kept stable and provided good protection for substrate during the early immersion in corrosion electrolyte. The passivation film showed the characteristics of n-type semiconductor. With the increase of immersion time, the slope of Mott-Schottky curves dropped and the carrier density rose, reflecting that the passivation film was under slow corrosion degradation in immersion process.
出处
《腐蚀与防护》
CAS
北大核心
2016年第12期973-978,1014,共7页
Corrosion & Protection
基金
南通市产学研协同创新项目(BC201410)
