摘要
传统刚性板的层偏的影响因素有很多，从板材涨缩，PE内层拉伸系数，内层曝光对准度，AOI冲孔精度，一直到层压铆合／融合／压合，每个厂商都有各自的一整套控制系统，针对压合这段流程对层偏的影响，本文专门针对压合条件进行识别，通过DOE的方式完成压合条件对层偏影响的量化数据分析，从而为指定压合生产条件，减少层偏给出了指引方向。
There are so many affected factors of mis-registration in traditional rigid PCB manufacturing process, such as material shrink, inner layer scaling factors, inner layer exposure registration ability, AOI PE PUNCH precision etc.. Each vender of PCB has its own system to control the registration. This paper has specifically identified the factors which infect mis-registration during lamination process, and has provided detailed guidelines for setting lamination parameters.
出处
《印制电路信息》
2016年第A02期273-280,共8页
Printed Circuit Information
基金
致谢：本课题在研究过程中由黎钦源总工的悉心指导完成,同时得到汤相平先生的大力支持与协助,在此表示感谢.
关键词
层偏
温升
转压点
高压压力
中压压力
Mis-Registration
Heating Up Rate
Turing Temperature
High-Pressure
Mid-Pressure
