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棉秆碎料轻质保温板性能研究

Study on thermal insulation property of lightweight cotton stalk particle board
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摘要 以棉秆为原料,经浸泡、蒸煮、搓磨分丝成纤维束,选择不同规格的棉秆碎料和不同比例的脲醛树脂胶,按照不同的目标密度,在设定的热压胶合条件下进行正交试验。通过KHQ-002H木材和人造板自动万能力学试验机和FWDR准稳态导热系数测试仪进行检测,得到静曲强度、弹性模量和导热系数等相关参数,再对其进行方案优化,得出工艺参数为密度0.4 g/cm3、施胶量10%、棉秆丝长度规格为10~15 mm的轻质碎料保温板的静曲强度、弹性模量和导热系数分别为13.3 MPa、1 353 MPa和0.134 w/m·℃。结果表明,低密度的棉秆碎料保温板导热系数接近或低于常用的建筑板材,具有良好的隔热保温性能,而且其力学性能能够满足墙体内衬保温材料以及非承重墙的隔墙材料的强度要求。 As a raw material, the cotton stalks are soaked, cooked, and ground to make fine fiber bundles. Particles of different sizes made from cotton stalks are chosen and mixed with formaldehyde resin adhesive of different proportion. Orthogonal test is done under the setting of hot press gluing conditions according to different densities. Through the KHQ-002H wood and artificial board automatic universal mechanical testing machine and FWDR quasi steady thermal conductivity test instrument for testing, the static bending strength, elastic modulus and heat conduction coefficient and other related parameters are obtained. By scheme optimization the process parameters are obtained for density, 0.4 g/cm3 applying glue quantity 10%, cotton stalk silk length specifications for 10~15 mm light broken material thermal insulation board of the static bending strength, elastic modulus and thermal conductivity were 13.3 MPa, 1 353 MPa and 0.134 w/m. degrees. The results show that thermal insulation plate heat conduction coefficient of the low density cotton stalk particle board is close to or lower than the commonly used construction materials, has good performance of heat insulation and heat preservation, and its mechanical properties can meet the wall lining insulation materials and non-load beating wall of wall material strength requirements.
作者 李赐生 宋健
出处 《中南林业科技大学学报》 CAS CSCD 北大核心 2016年第9期123-126,共4页 Journal of Central South University of Forestry & Technology
基金 湖南省科技厅科技计划项目(2013NK3129)
关键词 棉秆碎料 轻质保温板 静曲强度 弹性模量 导热系数 cotton stalk particles lightweight heat insulation board static bending strength modulus of elasticity thermal conductivity
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