摘要
采用一种新型的环境友好的ABS表面微蚀和活化技术以代替传统的铬酸微蚀和钯催化活化技术,经H_2SO_4-MnO_2微蚀后,ABS板表面变得粗糙,在其表面出现大量的羟基和羧基。通过吸附和硼氢化钠的还原,铜粒子沉积在ABS板表面,以取代SnCl_2/PdCl_2胶体催化活化。同时,研究了硫酸铜、硼氢化钠浓度、还原剂温度、还原时间对化学铜ABS板表面粘结强度的影响,最终得到的粘结强度为0.87 k N·m-1。
An environment-friendly surface etching and activation technique for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst.After etching by H_2SO_4-MnO_2 colloid,the ABS surfaces became rough;meanwhile the carboxyl and hydroxyl groups were formed on the surface.With absorption and reduction by a sodium borohydride solution,copper particles were deposited on the ABS surface,which serve as a catalyst replacement for Sn Cl_2/Pd Cl_2 colloid.The effects of Cu SO_4 concentration,Na BH_4 concentration,reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated.The average adhesion strengths reaches 0.87 k N·m^-1.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2016年第7期1709-1713,共5页
Rare Metal Materials and Engineering
基金
Provincial Natural Science Foundation of Zhejiang under Contract(Y14E010005)
关键词
化学沉积
还原剂
ABS板
粘结强度
electroless plating
reducing agent
ABS resin material
adhesion strength
