摘要
随着大数据和云存储的发展，对高端存储产品的要求也越来越高，PCB作为存储产品的重要组成部分，其工艺能力也随之不断提升，包括电镀塞孔、背钻、跳孔等特艺方面。文章以一款高端存储器产品为例，从PCB设计特点出发，对过程制作难点和挑战进行逐一概述，以供业界同行参考。
With the development of big data and cloud storage, high-end storage products are increasing with high requirements. PCB as an important part of storage products, the process capability is also upgrading, which includes POFV, back drilling, skip via and other special process. This paper takes a high-end storage product as an example, from the characteristics of PCB design, to make an overview of the process difficulty and challenge, which could be for a reference for industry peer.
出处
《印制电路信息》
2016年第A01期1-8,共8页
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