摘要
采用大塑性变形法(SPD)制备出了集成电路用纳米晶材料,同时利用透射电子显微镜(TEM)及电子万能试验机对不同SPD方法生产的Cu-Al合金进行微结构分析及拉伸性能试验。结果表明:层错能是影响纳米晶Cu-Al合金微观结构与拉伸性能的关键性因素,纳米晶Cu-Al合金的微观结构形成机制,平均晶粒尺寸以及强塑性匹配程度均随着层错能的降低而发生改变。
The large plastic deformation method was used to prepare nanocrystalline Cu-Al alloy in integrated circuit, and transmission electron microscopy（TEM） and electronic universal testing machine were used to analyze the microstructure and the tensile properties of Cu-Al alloy produced by different SPD methods. The results show that the stacking fault energy is a key factor affecting the microstructure and tensile properties of the Cu-Al alloy, the formation mechanism of the microstructure of nanocrystalline Cu-Al alloy, the average grain size and strong plastic matching degree change with the decrease of stacking fault energy.
出处
《铸造技术》
CAS
北大核心
2016年第3期421-423,共3页
Foundry Technology
关键词
纳米晶
CU-AL合金
微结构
层错能
nanocrystalline
Cu-Al alloy
microstructure
stacking fault energy
