摘要
随着我国4G网络的逐步覆盖,用于4G产品中的高层、高阶HDI线路板成为众多线路板制造厂商的重点攻关对象。结合我公司制作4G产品的实际情况,对其制程的主要控制要点进行概述,以供参考。
With China＇s 4G network will gradually cover, the products for 4G with high layer count, high grade HDI circuit board become the focus of many circuit board manufacturers for research object. Combining with practical situation in our 4G product, the key control points in the process overview is made for reference.
出处
《印制电路信息》
2016年第1期16-20,54,共6页
Printed Circuit Information
关键词
4G
趋肤效应
阻抗
涨缩
Leakage Plating
Impedance
Harmomegathus
