摘要
以微米级Cu粉和短碳纤维(SCF)作为复配导热填料,利用模压成型方法制备了聚醚醚酮(PEEK)/Cu/SCF二元导热复合材料,采用扫描电镜分析了复合材料的表面形貌,考察了导热填料用量对复合材料导热性能、表面电阻率、热性能的影响。结果表明:微米级Cu粉和SCF作为导热填料可以起到协同作用,显著改善了PEEK的导热性能;当Cu粉用量为10%时,随着SCF用量的增加,复合材料的导热系数明显提高,熔融温度降低,结晶度减小;SCF用量为20%时,复合材料的导热系数为0.832 W/(m·K),提高了162%;表面电阻率为108Ω,复合材料具有一定的抗静电性。
A kind of thermally conductive composites was obtained from mixture of micro-copper power（Cu）, short carbon fiber（SCF） and poly（ether-ether-ketone） （PEEK） by compression molding. Morphology was characterized by scanning electron microscopy. The effect of the content of filler on the thermal conductivity, surface resistivity and thermal performance of the composite was investigated. The results indicate that micro-copper power and short carbon fiber as thermal conductive filler can significantly improve the thermally conductive properties of PEEK; when the copper content is 10%, the thermal conductive increases obviously with the increasing of SCF content, and then the melt temperature declines and the crystallinity decreases. When the SCF filler content is up to 20%, the thermal conductivity and the surface resistivity are 0.832 W/（m·K） and 10^8 Ω, respectively. Composite materials have a certain antistatic performance.
出处
《塑料科技》
CAS
北大核心
2015年第5期52-55,共4页
Plastics Science and Technology
基金
863计划项目(SS2015AA031601)资助
关键词
聚醚醚酮
铜粉
短碳纤维
导热复合材料
Poly（ether-ether-ketone）
Copper power
Short carbon fiber
Thermally conductive composite
