摘要
Thermal management is a key issue in the integrated circuit(IC)design.In this paper,the superposition strategy was experimentally validated using a modeling IC device,which was fabricated by laboratory-level microfabrication technique.Metal thin film resistors on the top of dielectric layer were used to analogize the multiple hot-spots in the modeling IC device.The measured temperature rise with multiple hot-spots agrees well with the predictions given by the superposition calculations.With the help of the superposition strategy,thermal management of IC device can be significantly simplified by decomposing the system into sub-systems and optimizing each part individually.The influence coefficients in the superposition strategy extracted from the experimental measurement offer the IC designers a useful engineering tool to facility the thermal optimization and evaluate the thermal performance of IC devices.
基金
supported by the National Science and Technology Major Project of China(Grant No.2009ZX02038-02)
the Doctoral Fund of Ministry of Education of China(Grant No.20130001110006)
