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保温时间对添加中间层的钢/Mg焊接接头显微组织和性能的影响

Effect of Holding Time on Microstructure and Property of Welded Joints of Stainless Steel/Mg with Interlayer
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摘要 通过添加Cu箔中间层,采用两次焊接法连接不锈钢和镁合金,并对其焊接接头的剪切强度、显微硬度、显微组织进行了测试分析。结果表明,不锈钢-铜-镁扩散连接接头界面连接良好;焊接接头剪切强度随保温时间的增加先增加后减小,最大值达到45.2 MPa;金属间化合物显微硬度高于两侧Mg合金和Cu箔;随着保温时间的增加,金属间化合物层厚度增加。 The stainless steel and magnesium were welded by two step welding. The universal testing machine was used to obtain the shear strength of the bonded joint. The microhardness of the welded joints was obtained. The microstructure of the bonded joints was studied by optical microscope. The results show that the stainless-Cu/Mg joints welds well. The shear strength increases firstly and then decreases with the holding time increasing, and it exhibits a maximum value of 45.2 MPa. The microhardbness of the intermetallic is higher than those of Mg alloy and Cu foil. With the increase of the holding time, the thickness of the intermetallic increases.
出处 《热加工工艺》 CSCD 北大核心 2014年第15期180-181,185,共3页 Hot Working Technology
关键词 Cu箔 保温时间 显微组织 剪切强度 Cu foil holding time microstructure shear strength
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