摘要
BH无氰浸锌液是新开发的应用于高硅铝合金预处理的产品,其各方面性能与含氰浸锌接近而优于市售无氰浸锌产品。本文通过扫描电镜照片比较了纯铝和高硅铝合金经BH无氰浸锌、市售主流无氰浸锌及有氰浸锌处理后的表面形貌,发现无论是纯铝还是高硅铝合金,采用市售无氰浸锌液处理后的表面覆盖程度均较差,而BH无氰浸锌液和有氰浸锌液所得浸锌层的覆盖程度接近,介绍了BH无氰浸锌在工业上的应用情况及其在应用过程中产生的问题,如基体与铜层、挂具点附近、孔位、低位、凹槽以及铜与银层之间的起泡现象,分析了产生问题的原因,并提出了相应的解决办法,如:以水性笔代替油性笔标记镀件,每次电镀后对挂具进行退镀和将除垢温度控制在40°C以下,浸锌前增加热水清洗且清洗后甩净孔内液体,调整或更换碱铜槽,调整浸锌槽并加入配位剂,预镀银时工件带电入槽或调整镀银槽。
The BH cyanide-free zinc dipping solution is a newly developed product for pretreatment of high-silicon aluminum alloy. Its performances are close to that of a cyanide-containing zinc dipping product, and better than that of a commercially available cyanide-free counterpart. In this article, the surface morphologies of pure aluminum and high-silicon aluminum alloy treated by BH cyanide-free zinc dipping solution, marketed mainstream cyanide-free zinc dipping solution, and conventional cyanide-containing zinc dipping solution were compared by scanning electron microscopy. It was found that the zinc coating obtained on either pure aluminum or high-silicon aluminum alloy substrate from the commercial cyanide-free solution has worse surface coverage than those obtained from the BH cyanide-free zinc dipping solution and the cyanide-containing zinc dipping solution, both of which have similar coverage. The industrial application status of BH cyanide-free zinc dipping solution and the existing problems were introduced, such as bubbling between substrate and copper coating, near a rack, around a hole, at the bottom inside a cavity, at a groove, and between copper and silver coatings. The causes of these problems were analyzed and some corresponding measures were presented, such as replacing oil-based pens by water-based ones for marking the workpiece to be plated, stripping racks after electroplating, controlling the descaling temperature below 40 ℃, adding hot water rinse before zinc dipping, removing the water inside holes thoroughly after rinsing, adjusting the alkaline copper plating bath or replacing it by a fresh one, regulating zinc dipping bath with the addition of complexing agent, and applying electrical current to the workpieces prior to dipping them into silver pre-plating bath or regulating the silver plating bath.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第16期708-711,共4页
Electroplating & Finishing
关键词
高硅铝合金
无氰浸锌
微观形貌
故障排除
high-silicon aluminum alloy
cyanide-free zinc dipping
micromorphology
troubleshooting
