摘要
用 MeV能量的 Cl离子束辐照金属薄膜/绝缘体和硅基底。测量到薄膜在基底上附着增强的阈值剂量,在铜/硅体系中观测到低剂量和高剂量阈值。
Different matel film deposited on insulator and Si substrates were bombarded with MeV Cl ions. The threshold does enhanced adhesion effects were measured by the Scotch Tape respectively. It is found that there are two types of enhanced adhesion effects in Cu-Si system.
出处
《真空》
CAS
北大核心
1991年第3期32-34,共3页
Vacuum