3Lange B J, Wyser Y. Recent innovations in harrier technologies for plastic packaging-a review [ J]. Packing Technology and Science, 2003, 16: 149-158.
4Giustino F, Umari P, Pasquarello A. Dielectric effect of a thin SiO2 interlayer at the interface between silicon and high-k oxides [ J]. Microelectronic Engineering, 2004, 72: 299-303.
5Zhang J M, Dattatray S W, Ellen R F. Mechanisms of SiO2 films deposition from t ctramethylcyclotetrasiloxane, dimethyldimethoxysilane, and trimethylsilane plasmas [J]. J. Vac. Sci. Technol. A2004 22(1): 201-214.
6Granier A, Nicolazo F, Vallee C. Diagnostics in O2 helicon plasmas for SiO2 deposition[J]. Plasma Sources Sci. Technol, 1997, 6: 147-156.
7Laimer J, Stori H. Recent advances in the research on nonequilibrium atmospheric pressure plasma jets [ J ]. Plasma Process. Polym. , 2007, 4: 266-274.
8Laroussi M, Akan T. Arc-free atmospheric pressure cold plasma jets: a review[J]. Plasma Process. Polym. , 2007, 4: 777-788.
9Sawadat Y, Ogawat S and Kogomaf M. Synthesis of plasmapolymerized tetraethoxysilane and hexamethyldisiloxane films prepared by atmospheric pressure glow discharge[J]. J. Phys. D. Appl. Phys., 1995, 28:1661-1669.
10Chen Q, Zhang Y F, Han E, Ge Y J. SiO2-1ike film deposition by dieleetrie harrier discharge plasma gun at ambient temperature under an atmospheric pressure[J]. J. Vac. Sci. Technol. A, 2006, 24(6): 2082-2086.
