摘要
首先介绍混合集成电路封装技术的发展,然后讨论混合集成电路封装材料的选择及其依据,最后介绍新的混合集成电路封装材料。
The development of hybrid integrated circuit packaging technology is described firstly. Secondly the selection and basis of HIC packaging materials are discussed, Finally, the new packaging materials for HIC are provided.
出处
《电子元器件应用》
2002年第7期43-44,51,共3页
Electronic Component & Device Applications
关键词
混合集成电路
封装材料
金属材料
陶瓷材料
环氧树脂
Hybrid integrated circuit (HIC)
Package
Metal material
Ceramic material
Epoxy resin
