摘要
本文对近几年来运用单片制备方法 ,采用硅微机械加工技术 (MEMS)工艺研制的电容式微传声器进行了详细描述。通过分析和研究指出 ,将微传声器与其外围电路集成在单片上可降低器件噪声 ,采用纹膜或复合膜结构可增加器件的灵敏度 ,根据具体情况优化电极形状和尺寸 。
In this paper, a review of single wafer fabricated capacitive silicon microphones based on micromechanic systyms is given. The integration of a capacitive microphone and detection circuits will result in a further reduction of the noise. The application of corrugated or composite diaphragms offers the possibility to increase the sensitivity of microphone. The optimization of capacitor electrode shaping will improve the performance of microphone by increasing the sensor sensitivity and the signal noise ratio.
出处
《电子器件》
CAS
2002年第1期9-13,共5页
Chinese Journal of Electron Devices
