摘要
无损筛选是当前研究常规电路与加固电路具有抗辐射能力的有效方法，而无损筛选通常是指对电路最终产品进行的一种筛选。本文将以L54HC04电路研制为例，通过对其圆片级进行无损筛选试验，提出一个可以大大降低成本的无损筛选新方法-圆片级无损筛选。
No-damage-sieving is an efficiency way when we investigate general circuits and harden circuits that can resist radiate energy.In general meaning,no-damage-sieving is a finally screening for circuit production.There is an example of L54HC04 circuit investigation in this paper.A new way of sieving is presented,no-damage-sieving for wafers,which can reduce the cost of screening.
出处
《微处理机》
2002年第1期23-25,共3页
Microprocessors
