摘要
分析了SMT混装电路板所采用的主要焊接方式 ,着重就影响SMT波峰焊接质量的波峰焊机、工艺参数、焊料焊剂等主要工艺技术进行探讨。根据厦华电子公司的实际焊接情况 ,给出了波峰焊接的相关工艺参数 。
Analysed the main soldering way applied to SMT mix-assembled circuit board.Deeply inquires into the main technology about the wave soldering machine,technical parameters, solder and flux impacting on SMT wave soldering quality.Based on the practice of XOCECO,brings forward some correlative technical parameters of wave soldering.Then,makes some prospects on the SMT soldering technology.
出处
《电子工艺技术》
2002年第2期59-62,共4页
Electronics Process Technology
