摘要
通过特定的热处理工艺，分离出全片层组织的晶粒尺度和片层厚度两个主要的显微组织参数，研究了晶粒尺度和片层间距对全片层组织合金的强化效果。研究结果表明：合金的屈服强度随着晶粒尺度和片层厚度的减小而增加，符合Ｈａｌｌ－Ｐｅｔｃｈ强化关系。同时用屈服强度模型解释了晶粒尺度和片层厚度的强化效果。
A special heat treatment process was used to separate the microstructural parameters, mainly grain size and lamellar spacing. The strengthening effect of grain size and lamellar spacing on fully lamellar alloy has been studied. The result reveals that the yield strength increases with decreasing grain size and lamellar spacing. A model of yield strength is proposed to explain the strengthening effect of grain size and lamellar spacing:
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2001年第3期178-182,共5页
Rare Metal Materials and Engineering
基金
国家自然科学基金资助项目(项目号59895150)
