期刊文献+

微制造与数字制造——21世纪制造技术的重要发展方向 被引量:4

Micro Manufacturing and Digital Manufacturing——Key Areas of Mechatronics in 21st Century
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摘要 研究探讨了21世纪制造技术的两个重要发展方向——微制造技术和数字制造技术的基本概念、特征、研究内容和发展过程,提出了我们今后在微制造和数字制造技术方面重点研究内容。 The concepts, characteristics, connotation and development of micro manufacturing and digital manufacturing are presented and discussed. The emphases to be researched and developed of micro manufacturing and digital manufacturing are proposed.
出处 《机电工程》 CAS 2001年第5期1-3,共3页 Journal of Mechanical & Electrical Engineering
关键词 微制造 数字制造 机电一体化 制造技术 计算机集成制造 micro manufacturing digital manufacturing mechatronics
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同被引文献23

  • 1何世林,余立建.基于B/S结构的远程监控系统的分析与设计[J].计算机与现代化,2006(4):85-87. 被引量:4
  • 2Hayashi K, Fukui K, Tanaka Z, et al. Shape evolution of electrodeposited bumps into deep cavities [ J ]. Journal of The Electro- chemical Society,2001,148 : C145 -C148.
  • 3Yeh Yih min,Tu George Ohia, Fu Mingnan. Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio, Ni-Fe micro-mold insert [ J ]. Japanese Journal of Applied Physics,2003,42:6683 -6690.
  • 4Bard A J,Faulkner L R.电化学方法原理和应用[M].邵远华,译.北京:化学工业出版社,2005.
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  • 6Wang Weihua,Leith S D,Schwartz D T. Convective-diffusive,mass transfer inside complex micro molds during electrodeposition [ J ]. Journal of Microelectro Mechanical Systems,2002,11:118-124.
  • 7Budevski E, Staikov G. Electrocrystallization nucleation and growth phenomena[ J ]. Electrochemimica Acta,2000,45:2559 -2574.
  • 8Kondo K,Fukui K. Current evolution of electro-deposited copper bumps with photoresist angle[J]. Electrochemical Society,1998, 145:840 -843.
  • 9Kondo K, Fukui K. Shape evolution of electro-deposited bumps with deep cavity[J]. Electrochemical Society,1998,145:3007- 3010.
  • 10BARD AJ,FAULKNER LR.电化学方法原理和应用[M].邵元华,朱果逸,董献堆,等,译.北京:化学工业出版社,2005:178-181.

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