摘要
引线键合是集成电路第一级组装的主流技术 ,也是 30多年来电子器件得以迅速发展的一项关键技术。对引线键合技术和可能发生的失效现象进行了综述 ,对提高键合点长期储存 /使用可靠性具有指导意义。
Wire bonding is the first-level assembly technology for integrated circuits and is essential for the fast development of electronic devices during the past 30 years.The wire bonding technology and possible failure phenomenon have been reviewed.The contents will be guid for the improvement of long-term reliability of wire bonding.
出处
《电子工艺技术》
2001年第5期185-191,共7页
Electronics Process Technology
