摘要
日本学者对固态扩散焊界面空洞收缩机理进行了系列研究 :( 1)提出了二维界面几何模型 ;指出界面空洞收缩是在塑性变形、粘塑性变形、界面扩散及体积扩散四大机制作用下实现的 ;并估算了各机制的作用大小。( 2 )在基于空位扩散的界面扩散的数值计算中 ,考虑了因界面扩散引起的刚性位移及在不同接合率下的空洞间隔2L的变化 ;另外还研究了空洞表面扩散快慢对界面扩散的影响。 ( 3)首次提出了粘塑性变形机制的有限元模型 。
The main research content and conclusion of void shrinkage mechanism in solid state diffusion bonding by Japanese expert are as following: (1) They proposed a two-dimensional model for solid state bonding and indicated that the void shrinkage process was achieved by four mechanisms: plastic deformation, creep (viscoplatic) deformation, interface diffusion and volume diffusion. The numerical analysis made it possible to estimate the relative contribution of these four mechanisms. (2) In the numerical analysis of interface diffusion based on vacancy diffusion mechanism, rigid body displacement caused by interface diffusion and the change of the void spacing (2 L ) in various rate of bonding were taken into account. And the influence of surface diffusion speed along void surface on interface diffusion was also analyzed. (3) They first proposed a finite element model of void shrinkage on bonding-interface by viscoplastic deformation mechanism, and they found that the bulk constrained material greatly inhibited the void shrinkage rate in the later stage of bonding.$$$$
出处
《焊接》
2001年第10期14-18,共5页
Welding & Joining
