摘要
将环氧丙烯酸树脂分别和 5种多元羧酸酐反应 ,得羧基化环氧丙烯酸酯 ( CEA)树脂 ,实验了 6种催化剂 ,其中以四甲基溴化铵的效果较为理想 . CEA干膜可在较宽的酸值范围内被稀碱液完全洗脱 ,加入 CEA树脂 1 /3量的环氧树脂后 ,含马来酸酐及苯甲酸酐改性树脂的体系在预烘干后完全丧失碱液洗脱性能 ,而含琥珀酸酐、四氢化苯甲酸酐及六氢化苯甲酸酐改性树脂的体系预烘干后 ,在较高酸值时仍有较理想的碱液洗脱性能 .含四氢化苯甲酸酐及六氢化苯甲酸酐改性树脂的体系具有较快光聚合速率和较高转化率 ,含马来酸酐及苯甲酸酐改性树脂的体系光聚合性能较差 .含苯甲酸酐改性树脂的体系在光 -热双固化后 。
The photocurable carboxylated epoxy acrylate(CEA) resins were synthesized via the reaction between hydroxyl group on epoxy acrylate resin(EA) and polybasic carboxylic acid anhydride, e.g. maleic anhydride(MAn), phthalic anhydride(PAn), succinic anhydride (SAn), tetrahydrophthalic anhydride(THPAn) and hexahydrophthalic anhydride(HHPAn). The catalyst, such as tetramethyl ammonium bromide, could effectively accelerate the reaction. If one third of epoxy resin based on CEA was cooperated with CEA resin, the dried films comprised of MAn or PAn modified resin were completely unsoluble in alkaline solution before photocuring, but not for that comprised of SAn, TPAn or HPAn resins. The formulations mixtures containing THPAn or HHPAn resins could be photopolymerized rapidly to a greater extent compared with that containing MAn or PAn resins. The photocured and post thermal cured films exhibited satisfactory thermal stability except for that containing PAn resin. THPAn and HHPAn were the appropriate carboxylic anhydride for the preparation of the alkaline developable photosensitive solder resist.
出处
《应用化学》
CAS
CSCD
北大核心
2001年第8期606-609,共4页
Chinese Journal of Applied Chemistry
基金
国家自然科学基金资助课题 ( 5 99730 2 7)
