摘要
在Ni-P -B4 C合金电刷镀技术的基础上 ,研究了在镀液中加入B4 C微粒 ,通过改变镀液浓度、电压、pH值以及镀速等条件 ,达到改变镀层的厚度、硬度以及耐蚀性等。经过多次实验比较 ,得到了Ni-P -B4 C合金复合电刷镀镀液较佳的浓度配制。并对电刷镀镀液各成分在刷镀中的作用以及它们对镀速和镀层成分的影响等方面作了较详细的分析。进而对复合电刷镀中微粒的共沉积机理作了初步的探讨。从而提出了一套较完整的Ni-P -B4
The influence of plate liquid consisteny,voltage,the pH value and plating speed on film thickness,hardness and corrosion-resisting were studied by adding B 4C particle into Ni-P alloy electro-brush plate liquid.The effect of electro-brush plate liquid composition on plating speed and film composition was analysed in detail.At the same time,the deposit mechanism of compound electro-brush plate was discussed.A more complete Ni-P-B 4C comound electro-brush plate technology plan was obtained.
