摘要
本文研究了金在硫代硫酸盐溶液中溶解的阴极机理,结果表明,在含铜氨的溶液中,二价铜氨络离子在金表面直接还原,生成的一价铜氨络离子进入溶液后,迅速被氧化再生为二价铜氨络离子,后者又到金粒表面上还原。根据硫代硫酸盐浸金阳、阴极过程电化学研究的结果,提出了氨性硫代硫酸盐浸金的电化学—催化机理及模型。从本质上揭露了铜、氨在硫代硫酸盐浸金过程中的作用,填补了硫代硫酸盐提金理论的空白。
This paper made an investigation into the cathodic mechanism of gold dissolution in thiosulfate solution.It showed that Cu(NH3)42+ in the solution containing copper and ammonia was directly reduced on gold surface to form Cu(NH3)2+.The Cu(NH3)2+ was then oxidized rapidly after entering solution and regenerated Cu(NH3)42+. Again,the regenerated Cu(NH3)42+was reduced once more on-gold surface.On the basis of electrochemical study on anodic and cathodic process of leaching gold with thiosulfate, this paper expounded the electroche-mical-catalytical-mechanism and model of leaching gold with ammoniacal thiosulfate,through which the effect of copper and ammonia on gold leaching with thiosulfate was exposed essentially and the gap in this theory was thereupon filled.
出处
《黄金》
CAS
北大核心
1991年第10期32-37,共6页
Gold
基金
国家教委博士点基金资助课题
关键词
硫代硫酸盐
金
浸出
阴极过程
thiosulfate
leaching
gold
electrochemistry
cathodic process
