摘要
针对流通包装测试现状及存在的缺点 ,介绍了一种结合传感器、单片机和PC机技术的现场测试记录装置 ,探讨了其软、硬件结构 ,该装置具有使用范围广 ,运行时间长 ,体积小 。
According to the defects of current distribution damage measurement of package,this article introduces an automatic on-site instrument, which is based on sensor technique,single-chip microcomputer technique and PC communication This instrument is small and has the characteristics of wide working ranges,long duration time,low power consuming and no serve man
出处
《包装与食品机械》
CAS
2001年第2期6-9,共4页
Packaging and Food Machinery
基金
上海市教委科技基金项目
