集成元件——PCB(下)

Integrated Component Boards

下载PDF

导出

摘要 3.2平面电阻制造工艺的有关说明集成电阻印制板的平面电阻制造工艺与常规印制板制造工艺相比,基本上是相同的或者说是大同小异的.主要是应针对薄膜电阻材料之特性进行补充或处理,才能获得高质量的平面电阻.

作者林金堵

出处《印制电路信息》 2001年第4期22-25,共4页 Printed Circuit Information

关键词集成元件 PCB 印制电路板平面电阻制造工艺

参考文献6

1[1]Bruce Mahler," Planar Resistor Technology in high Speed Computer and Telecom Applications",IPC Printed Circuits Expo 1998, April 26- 30,1998. So 5- 6.
2[2]Bruce Mahler and RoyM.Signer," Thin film Resistor Technology" Printed Circuit Design ,June1986.
3[3]Bruce Mahler" BGA Termination Alternatirves", Electronic Packaging & Production,February 1996.
4[4]Dieter G.Weiss," Changes in the PCB world with new packaging technologies and the integration of passive components into the PCB", circuit world, 1998.2
5[5]Roy M. Signer, "Incorporating planar Resistors in PCB Designs", Electronic Manufacturing,1989.1
6[7]Ohmega Technologies. INC. "Ohmaga- Ply",Technical Bulletin, 1999, 6,F-IA

印制电路信息

2001年第4期

内容加载中请稍等...